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Accumulation and ultrastructural distribution of copper in Elsholtzia splendens.
J Zhejiang Univ Sci B. 2005 May; 6(5):311-8.JZ

Abstract

Copper accumulation and intracellular distribution in Elsholtzia splendens, a native Chinese Cu-tolerant and accumulating plant species, was investigated by transmission electron microscope (TEM) and gradient centrifugation techniques. Copper concentrations in roots, stems and leaves of E. splendens increased with increasing Cu levels in solution. After exposure to 500 micromol/L Cu for 8 d, about 1000 mg/kg Cu were accumulated in the stem and 250 mg/kg Cu in the leaf of E. splendens. At 50 micromol/L Cu, no significant toxicity was observed in the chloroplast and mitochondrion within its leaf cells, but separation appeared at the cytoplasm and the cell wall within the root cells. At >250 micromol/L Cu, both root and leaf cell organelles in E. splendens were damaged heavily by excessive Cu in vivo. Copper subcellular localization in the plant leaf after 8 days' exposure to 500 micromol/L Cu using gradient centrifugation techniques was found to be decreased in the order: chloroplast>cell wall>soluble fraction>other organelles. The plant root cell wall was found to be the site of highest Cu localization. Increase of Cu exposure time from 8 d to 16 d, increased slightly Cu concentration in cell wall fraction in roots and leaves, while that in the chloroplast fraction decreased in leaves of the plants grown in both 0.25 micromol/L and 500 micromol/L Cu. TEM confirmed that much more Cu localized in cell walls of E. splendens roots and leaves, but also more Cu localized in E. splendens' chloroplast when the plant is exposed to Cu levels>250 micromol/L, as compared to those in the plant grown in 0.25 micromol/L Cu. Copper treatment at levels>250 micromol/L caused pronounced damage in the leaf chloroplast and root organelles. Copper localization in cell walls and chloroplasts could mainly account for the high detoxification of Cu in E. splendens.

Authors+Show Affiliations

Ministry of Education Key Lab of Environment, Remediation and Ecosystem Health, School of Natural Resources and Environmental Science, Zhejiang University, Hangzhou 310029, China. penghongyun@zju.edu.cnNo affiliation info availableNo affiliation info available

Pub Type(s)

Journal Article
Research Support, Non-U.S. Gov't

Language

eng

PubMed ID

15822140

Citation

Peng, Hong-Yun, et al. "Accumulation and Ultrastructural Distribution of Copper in Elsholtzia Splendens." Journal of Zhejiang University. Science. B, vol. 6, no. 5, 2005, pp. 311-8.
Peng HY, Yang XE, Tian SK. Accumulation and ultrastructural distribution of copper in Elsholtzia splendens. J Zhejiang Univ Sci B. 2005;6(5):311-8.
Peng, H. Y., Yang, X. E., & Tian, S. K. (2005). Accumulation and ultrastructural distribution of copper in Elsholtzia splendens. Journal of Zhejiang University. Science. B, 6(5), 311-8.
Peng HY, Yang XE, Tian SK. Accumulation and Ultrastructural Distribution of Copper in Elsholtzia Splendens. J Zhejiang Univ Sci B. 2005;6(5):311-8. PubMed PMID: 15822140.
* Article titles in AMA citation format should be in sentence-case
TY - JOUR T1 - Accumulation and ultrastructural distribution of copper in Elsholtzia splendens. AU - Peng,Hong-Yun, AU - Yang,Xiao-E, AU - Tian,Sheng-Ke, PY - 2005/4/12/pubmed PY - 2005/10/1/medline PY - 2005/4/12/entrez SP - 311 EP - 8 JF - Journal of Zhejiang University. Science. B JO - J Zhejiang Univ Sci B VL - 6 IS - 5 N2 - Copper accumulation and intracellular distribution in Elsholtzia splendens, a native Chinese Cu-tolerant and accumulating plant species, was investigated by transmission electron microscope (TEM) and gradient centrifugation techniques. Copper concentrations in roots, stems and leaves of E. splendens increased with increasing Cu levels in solution. After exposure to 500 micromol/L Cu for 8 d, about 1000 mg/kg Cu were accumulated in the stem and 250 mg/kg Cu in the leaf of E. splendens. At 50 micromol/L Cu, no significant toxicity was observed in the chloroplast and mitochondrion within its leaf cells, but separation appeared at the cytoplasm and the cell wall within the root cells. At >250 micromol/L Cu, both root and leaf cell organelles in E. splendens were damaged heavily by excessive Cu in vivo. Copper subcellular localization in the plant leaf after 8 days' exposure to 500 micromol/L Cu using gradient centrifugation techniques was found to be decreased in the order: chloroplast>cell wall>soluble fraction>other organelles. The plant root cell wall was found to be the site of highest Cu localization. Increase of Cu exposure time from 8 d to 16 d, increased slightly Cu concentration in cell wall fraction in roots and leaves, while that in the chloroplast fraction decreased in leaves of the plants grown in both 0.25 micromol/L and 500 micromol/L Cu. TEM confirmed that much more Cu localized in cell walls of E. splendens roots and leaves, but also more Cu localized in E. splendens' chloroplast when the plant is exposed to Cu levels>250 micromol/L, as compared to those in the plant grown in 0.25 micromol/L Cu. Copper treatment at levels>250 micromol/L caused pronounced damage in the leaf chloroplast and root organelles. Copper localization in cell walls and chloroplasts could mainly account for the high detoxification of Cu in E. splendens. SN - 1673-1581 UR - https://www.unboundmedicine.com/medline/citation/15822140/Accumulation_and_ultrastructural_distribution_of_copper_in_Elsholtzia_splendens_ L2 - http://www.jzus.zju.edu.cn/article.php?doi=10.1631/jzus.2005.B0311 DB - PRIME DP - Unbound Medicine ER -