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Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries.
ACS Appl Mater Interfaces. 2016 05 25; 8(20):12594-8.AA

Abstract

Stretchable electronics have important applications in health monitoring and integrated lab-on-a-chip devices. This paper discusses the performance of serpentine stretchable interconnects printed using self-reducing, silver reactive inks. It details process optimization, device fabrication, and device characterization, while demonstrating the potential applications for reactive inks and new design strategies in stretchable electronics. Devices were printed with an ethanol stabilized silver diamine reactive ink and cycled to stretch ratios of 140 and 160% over 1000 cycles with less than 2.5% variation in electrical resistance. Maximum deformation before failure was measured at 180% elongation. Additionally, interconnect deformation was compared to finite element analysis (FEA) simulations to show that FEA can be used to accurately model the deformation of low-strain printed interconnects. Overall, this paper demonstrates a simple and affordable route toward stretchable electrical interconnects.

Authors+Show Affiliations

School for the Engineering of Matter, Transport, and Energy, Arizona State University , Tempe, Arizona 85271, United States.School for the Engineering of Matter, Transport, and Energy, Arizona State University , Tempe, Arizona 85271, United States.School for the Engineering of Matter, Transport, and Energy, Arizona State University , Tempe, Arizona 85271, United States.School for the Engineering of Matter, Transport, and Energy, Arizona State University , Tempe, Arizona 85271, United States.School for the Engineering of Matter, Transport, and Energy, Arizona State University , Tempe, Arizona 85271, United States.School for the Engineering of Matter, Transport, and Energy, Arizona State University , Tempe, Arizona 85271, United States.

Pub Type(s)

Letter
Research Support, Non-U.S. Gov't
Research Support, U.S. Gov't, Non-P.H.S.

Language

eng

PubMed ID

27158736

Citation

Mamidanna, Avinash, et al. "Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries." ACS Applied Materials & Interfaces, vol. 8, no. 20, 2016, pp. 12594-8.
Mamidanna A, Song Z, Lv C, et al. Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. ACS Appl Mater Interfaces. 2016;8(20):12594-8.
Mamidanna, A., Song, Z., Lv, C., Lefky, C. S., Jiang, H., & Hildreth, O. J. (2016). Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. ACS Applied Materials & Interfaces, 8(20), 12594-8. https://doi.org/10.1021/acsami.6b03922
Mamidanna A, et al. Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. ACS Appl Mater Interfaces. 2016 05 25;8(20):12594-8. PubMed PMID: 27158736.
* Article titles in AMA citation format should be in sentence-case
TY - JOUR T1 - Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. AU - Mamidanna,Avinash, AU - Song,Zeming, AU - Lv,Cheng, AU - Lefky,Christopher S, AU - Jiang,Hanqing, AU - Hildreth,Owen J, Y1 - 2016/05/11/ PY - 2016/5/10/entrez PY - 2016/5/10/pubmed PY - 2016/5/10/medline KW - conductive inks KW - drop-on-demand KW - flexible electronics KW - printing KW - reactive inks KW - serpentine KW - stretchable electronics SP - 12594 EP - 8 JF - ACS applied materials & interfaces JO - ACS Appl Mater Interfaces VL - 8 IS - 20 N2 - Stretchable electronics have important applications in health monitoring and integrated lab-on-a-chip devices. This paper discusses the performance of serpentine stretchable interconnects printed using self-reducing, silver reactive inks. It details process optimization, device fabrication, and device characterization, while demonstrating the potential applications for reactive inks and new design strategies in stretchable electronics. Devices were printed with an ethanol stabilized silver diamine reactive ink and cycled to stretch ratios of 140 and 160% over 1000 cycles with less than 2.5% variation in electrical resistance. Maximum deformation before failure was measured at 180% elongation. Additionally, interconnect deformation was compared to finite element analysis (FEA) simulations to show that FEA can be used to accurately model the deformation of low-strain printed interconnects. Overall, this paper demonstrates a simple and affordable route toward stretchable electrical interconnects. SN - 1944-8252 UR - https://www.unboundmedicine.com/medline/citation/27158736/Printing_Stretchable_Spiral_Interconnects_Using_Reactive_Ink_Chemistries_ L2 - https://doi.org/10.1021/acsami.6b03922 DB - PRIME DP - Unbound Medicine ER -
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