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Corrigendum: Strain-stress relationship and dislocation evolution of W-Cu bilayers from a constructed n-body W-Cu potential (2019 J. Phys.: Condens. Matter 31 305002).

Abstract

An n-body W-Cu potential is constructed under the framework of the embedded-atom method by means of a proposed function of the cross potential. This W-Cu potential is realistic to reproduce mechanical property and structural stability of WCu solid solutions within the entire composition range, and has better performances than the three W-Cu potentials already published in the literature. Based on this W-Cu potential, molecular dynamics simulation is conducted to reveal the mechanical property and dislocation evolution of the bilayer structure between pure W and W0.7Cu0.3 solid solution. It is found that the formation of the interface improves the strength of the W0.7Cu0.3 solid solutions along tensile loading perpendicular to the interface, as the interface impedes the evolution of the dislocation lines from the W0.7Cu0.3 solid solutions to the W part. Simulation also reveals that the interface has an important effect to significantly reduce the tensile strength and critical strain of W along the tensile loading parallel to the interface, which is intrinsically due to the slip of the edge or screw dislocations at low strains as a result of the lattice mismatch.

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  • Authors+Show Affiliations

    ,

    Central South University, Changsha, Hunan, CHINA.

    ,

    Nanchang Hangkong University, Nanchang, 330063, CHINA.

    ,

    State Key Lab of Powser Metallurgy, Central South University, Changsha, 410083, CHINA.

    State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan, CHINA.

    Source

    Pub Type(s)

    Journal Article

    Language

    eng

    PubMed ID

    31207587

    Citation

    Wei, Wei, et al. "Corrigendum: Strain-stress Relationship and Dislocation Evolution of W-Cu Bilayers From a Constructed N-body W-Cu Potential (2019 J. Phys.: Condens. Matter 31 305002)." Journal of Physics. Condensed Matter : an Institute of Physics Journal, 2019.
    Wei W, Chen L, Gong H, et al. Corrigendum: Strain-stress relationship and dislocation evolution of W-Cu bilayers from a constructed n-body W-Cu potential (2019 J. Phys.: Condens. Matter 31 305002). J Phys Condens Matter. 2019.
    Wei, W., Chen, L., Gong, H., & Fan, J. (2019). Corrigendum: Strain-stress relationship and dislocation evolution of W-Cu bilayers from a constructed n-body W-Cu potential (2019 J. Phys.: Condens. Matter 31 305002). Journal of Physics. Condensed Matter : an Institute of Physics Journal, doi:10.1088/1361-648X/ab2a67.
    Wei W, et al. Corrigendum: Strain-stress Relationship and Dislocation Evolution of W-Cu Bilayers From a Constructed N-body W-Cu Potential (2019 J. Phys.: Condens. Matter 31 305002). J Phys Condens Matter. 2019 Jun 17; PubMed PMID: 31207587.
    * Article titles in AMA citation format should be in sentence-case
    TY - JOUR T1 - Corrigendum: Strain-stress relationship and dislocation evolution of W-Cu bilayers from a constructed n-body W-Cu potential (2019 J. Phys.: Condens. Matter 31 305002). AU - Wei,Wei, AU - Chen,Liang, AU - Gong,Haoran, AU - Fan,Jinglian, Y1 - 2019/06/17/ PY - 2019/6/18/entrez PY - 2019/6/18/pubmed PY - 2019/6/18/medline KW - Dislocation evolution KW - Molecular dynamic simulation KW - Strain-stress relationship KW - W-Cu interface KW - W-Cu potential JF - Journal of physics. Condensed matter : an Institute of Physics journal JO - J Phys Condens Matter N2 - An n-body W-Cu potential is constructed under the framework of the embedded-atom method by means of a proposed function of the cross potential. This W-Cu potential is realistic to reproduce mechanical property and structural stability of WCu solid solutions within the entire composition range, and has better performances than the three W-Cu potentials already published in the literature. Based on this W-Cu potential, molecular dynamics simulation is conducted to reveal the mechanical property and dislocation evolution of the bilayer structure between pure W and W0.7Cu0.3 solid solution. It is found that the formation of the interface improves the strength of the W0.7Cu0.3 solid solutions along tensile loading perpendicular to the interface, as the interface impedes the evolution of the dislocation lines from the W0.7Cu0.3 solid solutions to the W part. Simulation also reveals that the interface has an important effect to significantly reduce the tensile strength and critical strain of W along the tensile loading parallel to the interface, which is intrinsically due to the slip of the edge or screw dislocations at low strains as a result of the lattice mismatch. SN - 1361-648X UR - https://www.unboundmedicine.com/medline/citation/31207587/Corrigendum:_Strain-stress_relationship_and_dislocation_evolution_of_W-Cu_bilayers_from_a_constructed_n-body_W-Cu_potential_(2019_J._Phys.:_Condens._Matter_31_305002) L2 - https://doi.org/10.1088/1361-648X/ab2a67 DB - PRIME DP - Unbound Medicine ER -